Intel ya sake saka dala biliyan 20 don gina masana'antar guntu guda biyu.Sarkin fasahar "1.8nm" ya dawo

A ranar 9 ga watan Satumba, agogon kasar, shugaban kamfanin Intel Kissinger ya sanar da cewa zai zuba jarin dala biliyan 20 don gina sabuwar babbar masana'antar wafer a jihar Ohio ta Amurka.Wannan wani bangare ne na dabarun IDM 2.0 na Intel.Gaba dayan shirin zuba jarin ya kai dala biliyan 100.Ana sa ran za a samar da sabon masana'anta a cikin 2025. A lokacin, tsarin "1.8nm" zai mayar da Intel zuwa matsayi na jagorancin semiconductor.

Tun lokacin da ya zama shugaban kamfanin Intel a watan Fabrairun bara, Kissinger ya himmatu wajen inganta gine-ginen masana'antu a Amurka da ma duniya baki daya, wadanda akalla dalar Amurka biliyan 40 aka zuba a Amurka.A bara, ya zuba jarin dalar Amurka biliyan 20 a Arizona don gina masana'antar wafer.A wannan karon, ya kuma saka hannun jarin dalar Amurka biliyan 20 a Ohio, sannan ya gina sabuwar masana'antar yin hatimi da gwaji a New Mexico.

Intel ya sake saka dala biliyan 20 don gina masana'antar guntu guda biyu.Sarkin fasahar "1.8nm" ya dawo

Har ila yau, masana'antar Intel babbar masana'anta ce ta na'ura mai kwakwalwa da aka gina wacce aka gina a Amurka bayan zartar da lissafin tallafin guntu na dalar Amurka biliyan 52.8.Don haka ne ma shugaban kasar Amurka ya halarci bikin kaddamarwar, da kuma gwamnan jihar Ohio da wasu manyan jami'an kananan hukumomi.

Intel ya sake saka dala biliyan 20 don gina masana'antar guntu guda biyu.Sarkin fasahar "1.8nm" ya dawo

Tushen kera guntu na Intel zai ƙunshi masana'antun wafer guda biyu, waɗanda za su iya ɗaukar har zuwa masana'antu takwas da tallafawa tsarin tallafin muhalli.Tana da fadin kasa kusan kadada 1000, wato murabba'in kilomita 4.Zai haifar da guraben ayyuka 3000 da ake biyan kuɗi mai yawa, ayyukan gine-gine 7000, da dubun dubatan ayyukan haɗin gwiwar sarkar samar da kayayyaki.

Ana sa ran waɗannan masana'antar wafer guda biyu za su samar da yawa a cikin 2025. Intel bai faɗi takamaiman matakin aiwatar da masana'antar ba, amma Intel ya faɗi a baya cewa zai mallaki tsarin CPU na ƙarni 5 a cikin shekaru 4, kuma zai samar da 20a da yawa. da 18a tsarin tsarawa biyu a cikin 2024. Don haka, masana'anta a nan ma yakamata su samar da tsarin 18a a lokacin.

20a da 18a sune matakai na farko na guntu na duniya don isa matakin EMI, daidai da tsarin 2nm da 1.8nm na abokai.Za su kuma ƙaddamar da fasahar fasahar bakaken fata guda biyu na Intel, ribbon FET da powervia.

A cewar Intel, ribbonfet shine aiwatar da Intel na kofa a kusa da transistor.Zai zama sabon sabon tsarin gine-ginen transistor na farko tun lokacin da kamfanin ya fara ƙaddamar da FinFET a cikin 2011. Wannan fasaha yana haɓaka saurin sauyawa na transistor kuma yana cimma daidaitaccen tuki kamar tsarin fin multi fin, amma yana ɗaukar sarari kaɗan.

Powervia ita ce ta musamman ta Intel kuma cibiyar watsa wutar lantarki ta farko ta masana'antar, wacce ke haɓaka watsa siginar ta hanyar kawar da buƙatar samar da wutar lantarki da