Kasuwancin OEM, wanda har yanzu yana cikin ruwa mai zurfi, ya sami matsala musamman kwanan nan.Bayan Samsung ya ce zai samar da 1.4nm a cikin 2027 kuma TSMC na iya komawa kan karagar semiconductor, Intel kuma ya ƙaddamar da "tsarin OEM" don taimakawa IDM2.0 mai ƙarfi.
A taron Intel On Technology Innovation Summit da aka gudanar kwanan nan, Shugaba Pat Kissinger ya sanar da cewa Intel OEM Service (IFS) zai shigo da zamanin "System matakin OEM".Ba kamar yanayin OEM na gargajiya wanda ke ba abokan ciniki kawai damar masana'antar wafer ba, Intel zai samar da cikakkiyar bayani wanda ya rufe wafers, fakiti, software da kwakwalwan kwamfuta.Kissinger ya jaddada cewa "wannan yana nuna alamar canji daga tsarin akan guntu zuwa tsarin a cikin kunshin."
Bayan Intel ya haɓaka tafiya zuwa IDM2.0, ya yi ayyuka akai-akai kwanan nan: ko yana buɗe x86, shiga sansanin RISC-V, samun hasumiya, faɗaɗa ƙawancen UCIe, sanar da dubun biliyoyin daloli na shirin fadada layin samar da OEM, da sauransu. ., wanda ke nuna cewa zai sami kyakkyawan fata a kasuwar OEM.
Yanzu, shin Intel, wanda ya ba da "babban motsi" don masana'antar kwangilar matakin tsarin, zai ƙara ƙarin kwakwalwan kwamfuta a cikin yaƙin "sarakuna uku"?
An riga an gano "fitowa" na tsarin tsarin OEM ra'ayin.
Bayan tafiyar hawainiyar Dokar Moore, samun daidaito tsakanin ƙarfin transistor, amfani da wutar lantarki da girman yana fuskantar ƙarin ƙalubale.Koyaya, aikace-aikacen da ke fitowa suna ƙara buƙatar aiki mai ƙarfi, ikon sarrafa kwamfuta mai ƙarfi da kwakwalwan kwamfuta iri-iri masu haɗaɗɗiya, suna motsa masana'antar don gano sabbin hanyoyin warwarewa.
Tare da taimakon ƙira, masana'anta, marufi na ci gaba da haɓakar Chiplet na baya-bayan nan, da alama sun zama ijma'i don gane "rayuwar" na Dokar Moore da ci gaba da sauyawar aikin guntu.Musamman ma game da ƙayyadaddun ƙayyadaddun tsari a nan gaba, haɗin gwiwar chiplet da marufi na ci gaba zai zama mafita da ta karya ta Dokar Moore.
Ma'aikatar da ta maye gurbin, wacce ita ce "babban ƙarfi" na ƙirar haɗin gwiwa, masana'anta da marufi na ci gaba, a fili yana da fa'idodi da albarkatu waɗanda za a iya farfado da su.Sanin wannan yanayin, manyan 'yan wasa, kamar TSMC, Samsung da Intel, suna mai da hankali kan shimfidawa.
A cikin ra'ayi na wani babban mutum a cikin masana'antar OEM semiconductor, tsarin tsarin OEM shine yanayin da ba zai yiwu ba a nan gaba, wanda yayi daidai da fadada yanayin IDM pan, kama da CIDM, amma bambancin shine CIDM aiki ne na kowa don kamfanoni daban-daban don haɗawa, yayin da pan IDM shine haɗa ayyuka daban-daban don samar da abokan ciniki tare da TurnkeySolution.
A cikin wata hira da Micronet, Intel ya ce daga tsarin tallafi guda huɗu na tsarin matakin OEM, Intel yana da tarin fasahohi masu fa'ida.
A matakin masana'antar wafer, Intel ya haɓaka sabbin fasahohi irin su RibbonFET transistor architecture da samar da wutar lantarki ta PowerVia, kuma yana ci gaba da aiwatar da shirin don haɓaka nodes ɗin tsari guda biyar cikin shekaru huɗu.Intel kuma na iya samar da ci-gaba fasahar marufi kamar EMIB da Foveros don taimakawa masana'antun ƙirar guntu haɗa injunan kwamfuta daban-daban da fasahar sarrafawa.Mahimman abubuwan haɗin gwal suna ba da sassauci mafi girma don ƙira da fitar da masana'antar gaba ɗaya don ƙirƙira cikin farashi, aiki da amfani da wutar lantarki.Intel ya himmatu wajen gina ƙawancen UCIe don taimakawa ƙira daga masu samarwa daban-daban ko matakai daban-daban suyi aiki tare mafi kyau.Dangane da software, kayan aikin software na buɗe tushen Intel OpenVINO da oneAPI na iya haɓaka isar da samfur da baiwa abokan ciniki damar gwada mafita kafin samarwa.
Tare da "masu kariya" guda huɗu na matakin tsarin OEM, Intel yana tsammanin cewa transistor da aka haɗa akan guntu guda ɗaya za su faɗaɗa sosai daga biliyan 100 na yanzu zuwa matakin tiriliyan, wanda shine ainihin ƙarshe.
"Ana iya ganin cewa matakin tsarin Intel na OEM burin ya dace da dabarun IDM2.0, kuma yana da fa'ida mai yawa, wanda zai kafa tushe don ci gaban Intel a nan gaba."Mutanen da ke sama sun kara bayyana fatansu ga Intel.
Lenovo, wanda ya shahara ga "mafilar guntu tasha ɗaya", da kuma tsarin "masana'antar tasha ɗaya" na yau sabon tsarin OEM, na iya haifar da sabbin canje-canje a cikin kasuwar OEM.
Nasara kwakwalwan kwamfuta
A zahiri, Intel ya yi shirye-shirye da yawa don tsarin matakin OEM.Baya ga kari daban-daban na ƙididdigewa da aka ambata a sama, ya kamata mu ga yunƙurin da ƙoƙarin haɗin kai da aka yi don sabon tsarin ƙaddamar da matakin tsarin.
Chen Qi, mutum a cikin masana'antar semiconductor, ya bincika cewa daga ajiyar albarkatun da ake da su, Intel yana da cikakken x86 IP na gine-gine, wanda shine ainihinsa.A lokaci guda, Intel yana da babban saurin SerDes class interface IP kamar PCIe da UCle, waɗanda za a iya amfani da su don haɗawa da haɗa kai tsaye da chiplets tare da Intel core CPUs.Bugu da kari, Intel ne ke sarrafa tsarin tsara ma'auni na PCIe Technology Alliance, kuma CXL Alliance da ka'idojin UCle da aka haɓaka bisa tushen PCIe su ma Intel ke jagoranta, wanda yayi daidai da Intel yana ƙware da ainihin IP da babban maɓalli. -Speed SerDes fasaha da ma'auni.
“Fasaha na haɗaɗɗen marufi na Intel da ƙarfin aiwatar da ci gaba ba su da rauni.Idan ana iya haɗa shi tare da x86IP core da UCIe, hakika zai sami ƙarin albarkatu da murya a cikin tsarin tsarin OEM zamanin, kuma ya ƙirƙiri sabon Intel, wanda zai kasance mai ƙarfi. "Chen Qi ya fadawa Jiwei.com.
Ya kamata ku sani cewa waɗannan duk ƙwarewa ce ta Intel, waɗanda ba za a iya nuna su cikin sauƙi a da ba.
"Saboda ƙarfin da yake da shi a cikin filin CPU a baya, Intel ya kula da mahimmancin kayan aiki a cikin tsarin - albarkatun ƙwaƙwalwar ajiya.Idan wasu kwakwalwan kwamfuta a cikin tsarin suna son amfani da albarkatun ƙwaƙwalwar ajiya, dole ne su samo su ta hanyar CPU.Don haka, Intel na iya taƙaita guntun wasu kamfanoni ta wannan motsi.A baya, masana'antar sun koka game da wannan' a kaikaice '' monopoly ''.Chen Qi ya bayyana cewa, "Amma tare da ci gaban zamani, Intel ya ji matsin lamba daga kowane bangare, don haka ya dauki matakin canza, bude fasahar PCIe, kuma ya kafa CXL Alliance da UCle Alliance a jere, wanda yayi daidai da rayayye. ajiye kek akan teburin."
Ta fuskar masana'antar, fasahar Intel da shimfidawa a cikin ƙirar IC da marufi na ci gaba har yanzu suna da ƙarfi sosai.Ishaya Bincike ya yi imanin cewa motsin Intel zuwa yanayin tsarin tsarin OEM yanayin shine don haɗa fa'idodi da albarkatu na waɗannan bangarorin biyu tare da bambanta sauran abubuwan da aka samo ta hanyar ma'anar tsarin tsayawa ɗaya daga ƙira zuwa marufi, don samun ƙarin umarni a cikin kasuwar OEM na gaba.
"Ta wannan hanyar, maganin Turnkey yana da kyau sosai ga ƙananan kamfanoni waɗanda ke da ci gaba na farko da ƙarancin albarkatun R&D."Binciken Ishaya kuma yana da kyakkyawan fata game da jan hankalin yunƙurin Intel zuwa ƙanana da matsakaitan abokan ciniki.
Ga manyan abokan ciniki, wasu masana masana'antu sun faɗi gaskiya cewa mafi kyawun fa'idar matakin tsarin tsarin Intel OEM shine yana iya haɓaka haɗin gwiwa tare da wasu abokan cinikin cibiyar bayanai, kamar Google, Amazon, da sauransu.
"Na farko, Intel na iya ba su izini su yi amfani da CPU IP na Intel X86 gine-gine a cikin nasu kwakwalwan kwamfuta na HPC, wanda ke da tasiri don kiyaye kason kasuwar Intel a cikin filin CPU.Na biyu, Intel na iya samar da babbar hanyar sadarwa ta IP kamar UCle, wanda ya fi dacewa ga abokan ciniki don haɗa sauran IP mai aiki.Na uku, Intel yana ba da cikakkiyar dandamali don magance matsalolin yawo da tattarawa, samar da sigar Amazon na guntu mafitacin chiplet wanda Intel zai shiga cikin ƙarshe Ya kamata ya zama ingantaccen tsarin kasuwanci.” Masana na sama sun kara da cewa.
Har yanzu ana buƙatar gyara darussa
Koyaya, OEM yana buƙatar samar da kunshin kayan aikin haɓaka dandamali da kafa manufar sabis na “abokin ciniki na farko”.Daga tarihin Intel da ya gabata, ya kuma gwada OEM, amma sakamakon bai gamsar ba.Kodayake matakin OEM na tsarin zai iya taimaka musu su gane burin IDM2.0, ƙalubalen da ke ɓoye har yanzu suna buƙatar shawo kan su.
"Kamar yadda ba a gina Rome a cikin yini ba, OEM da marufi ba sa nufin cewa komai yana da kyau idan fasahar tana da ƙarfi.Ga Intel, babban kalubale har yanzu shine al'adun OEM. "Chen Qi ya fadawa Jiwei.com.
Chen Qijin ya ci gaba da nuna cewa, idan har ana iya magance na'urorin Intel na muhalli, kamar masana'antu da software, ta hanyar kashe kudi, canja wurin fasaha ko yanayin dandali, babban kalubalen Intel shi ne gina al'adun OEM daga tsarin, koyan sadarwa tare da abokan ciniki. , samar da abokan ciniki da sabis da suke bukata, da kuma saduwa da daban-daban OEM bukatun.
Bisa ga binciken da Ishaya ya yi, kawai abin da Intel ke buƙatar ƙarawa shine ikon samar da wafer.Idan aka kwatanta da TSMC, wanda ke da ci gaba da kwanciyar hankali manyan abokan ciniki da samfuran don taimakawa haɓaka yawan amfanin kowane tsari, Intel galibi yana samar da nasa samfuran.Dangane da ƙayyadaddun nau'ikan samfura da iya aiki, ƙarfin haɓakawa na Intel don kera guntu yana iyakance.Ta hanyar tsarin tsarin OEM yanayin, Intel yana da damar jawo hankalin wasu abokan ciniki ta hanyar ƙira, ci-gaba marufi, core hatsi da sauran fasahohi, da kuma inganta wafer iya aiki mataki-mataki daga kananan adadin iri-iri kayayyakin.
Bugu da kari, a matsayin “Password Password” na tsarin matakin OEM, Advanced Packaging da Chiplet suma suna fuskantar nasu matsalolin.
Ɗaukar marufi matakin tsarin a matsayin misali, daga ma'anarsa, yana daidai da haɗuwa da Dies daban-daban bayan samar da wafer, amma ba sauki.Dauke TSMC a matsayin misali, daga farkon mafita ga Apple zuwa na baya OEM na AMD, TSMC ya shafe shekaru masu yawa akan fasahar marufi na ci gaba kuma ya ƙaddamar da dandamali da yawa, irin su CoWoS, SoIC, da sauransu, amma a ƙarshe, yawancin su. har yanzu suna ba da wasu nau'ikan sabis na marufi na hukuma, wanda ba shine ingantaccen marufi ba wanda ake yayatawa don samar wa abokan ciniki "kwakwalwa kamar tubalan gini".
A ƙarshe, TSMC ta ƙaddamar da dandamali na 3D Fabric OEM bayan haɗa fasahohin marufi daban-daban.A lokaci guda, TSMC ya yi amfani da damar da za ta shiga cikin kafa UCle Alliance, kuma ya yi ƙoƙari ya haɗa ka'idodinsa tare da ka'idodin UCIe, wanda ake sa ran zai inganta "ginin gine-gine" a nan gaba.
Makullin haɗin ɓangarorin ɓangarorin shine don haɗa “harshen”, wato, daidaita ƙirar ƙirar chiplet.A saboda wannan dalili, Intel ya sake yin amfani da banner na tasiri don kafa ma'aunin UCIE don guntu zuwa guntu haɗin gwiwa dangane da ma'aunin PCIe.
A bayyane yake, har yanzu yana buƙatar lokaci don daidaitaccen "kwance kwastan".Linley Gwennap, shugaba kuma babban manazarci na The Linley Group, ya gabatar a wata hira da Micronet cewa, abin da masana'antu ke bukata da gaske shine daidaitaccen hanyar haɗa muryoyin tare, amma kamfanoni suna buƙatar lokaci don ƙira sabbin ƙira don saduwa da ƙa'idodi masu tasowa.Kodayake an sami ɗan ci gaba, har yanzu yana ɗaukar shekaru 2-3.
Wani babban jami'in semiconductor ya bayyana shakku daga mahanga iri-iri.Zai ɗauki lokaci don lura ko kasuwa za ta sake karɓar Intel bayan janyewarta daga sabis na OEM a cikin 2019 da dawowa cikin ƙasa da shekaru uku.Dangane da fasaha, tsarin CPU na gaba da ake tsammanin Intel zai ƙaddamar da shi a cikin 2023 har yanzu yana da wahala a nuna fa'idodi ta fuskar tsari, ƙarfin ajiya, ayyukan I/O, da sauransu. Bugu da ƙari, tsarin tsarin Intel ya jinkirta sau da yawa. a baya, amma a yanzu dole ne a aiwatar da sake fasalin ƙungiyoyi, haɓaka fasaha, gasar kasuwa, ginin masana'anta da sauran ayyuka masu wahala a lokaci guda, wanda da alama yana ƙara haɗarin da ba a sani ba fiye da ƙalubalen fasaha na baya.Musamman, ko Intel na iya kafa sabon tsarin tsarin samar da kayayyaki na OEM a cikin gajeren lokaci shima babban gwaji ne.
Lokacin aikawa: Oktoba-25-2022