samfur Properties
TYPE
BAYANI
category
Haɗin kai (IC)
Abun ciki - Tsarin Akan Chip (SoC)
masana'anta
AMD Xilinx
jerin
Zynq® UltraScale+™ MPSoC CG
Kunshin
tire
Matsayin samfur
a hannun jari
Gine-gine
MCU, FPGA
core processor
Dual Core ARM® Cortex®-A53 MPCore™ tare da CoreSight™, Dual Core ARM® Cortex™-R5 tare da CoreSight™
Girman walƙiya
-
Girman RAM
256 KB
Na'urorin haɗi
DMA, WDT
Haɗuwa
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
gudun
533MHz, 1.3GHz
babban sifa
Zynq® UltraScale+™ FPGA, 103K+ sel dabaru
zafin aiki
-40°C ~ 100°C (TJ)
Kunshin / Rushewa
784-BFBGA, FCBGA
Kunshin na'urar mai bayarwa
784-FCBGA (23×23)
I/O ƙidaya
252
Lambar samfurin asali
XCZU2
Mai jarida da Zazzagewa
NAU'IN ARZIKI
MAHADI
Ƙayyadaddun bayanai
Bayanin Zynq UltraScale+ MPSoC
Bayanin muhalli
Xiliinx RoHS Certificate
Xilinx REACH211 Cert
EDA/CAD model
XCZU2CG-2SFVC784I ta SnapEDA
Rarraba muhalli da fitarwa
SIFFOFI
BAYANI
Matsayin RoHS
Mai yarda da ƙayyadaddun ROHS3
Matsayin Ji daɗin Danshi (MSL)
4 (72 hours)
Matsayin ISAR
Kayayyakin da ba su isa ba
ECN
5A002A4XIL
HTSUS
8542.39.0001
