Haɗin kai (IC)
Abun ciki
Abun ciki - Tsarin Akan Chip (SoC)
masana'anta Intel
jerin Automotive, AEC-Q100, Cyclone® V SE
Kunshin tire
Matsayin samfur a hannun jari
Architecture MCU, FPGA
core processor Dual-Core ARM® Cortex®-A9 MPCore™ tare da CoreSight™
Girman walƙiya -
RAM girma 64KB
Abubuwan DMA, POR, WDT
Haɗin kai CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
gudun 700 MHz
babban sifa FPGA - 85K dabaru abubuwa
Yanayin aiki -40°C ~ 125°C (TJ)
Kunshin / Yadi 896-BGA
Kunshin Na'urar Mai Bayarwa 896-FBGA (31×31)
